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Japan Says $550 Billion Package in Trade Deal Could Finance Taiwan Chipmaker in U.S.

2025-07-19T063518Z_1436941249_RC2IPFAX3FNX_RTRMADP_3_JAPAN-USA-BESSENT

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Reuters

15:36 JST, July 27, 2025

TOKYO (Reuters) — Japan’s $550 billion investment package agreed in this week’s U.S. tariff deal could help finance a Taiwan firm building semiconductor plants in the U.S., Japan’s top trade negotiator Ryosei Akazawa said on Saturday.

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